Tuesday, December 25, 2007

VIA Green Computing initiative

VIA Technologies Green Computing initiatives
New Delhi December 26, 2007 VIA Technologies, a company that provides motherboard chipsets, CPUs, and other computer hardware, introduced its initiative for "green computing" in 2001. With this green vision, the company has been focusing on power efficiency throughout the design and manufacturing process of its products. Its environmentally friendly products are manufactured using a range of clean-computing strategies, and the company is striving to educate markets on the benefits of green computing for the sake of the environment, as well as productivity and overall user experience.
Carbon-free computing
One of the VIA Technologies’ ideas is to reduce the "carbon footprint" of users — the amount of greenhouse gases produced, measured in units of carbon dioxide (CO2). Greenhouse gases naturally blanket the Earth and are responsible for its more or less stable temperature. An increase in the concentration of the main greenhouse gases — carbon dioxide, methane, nitrous oxide, and fluorocarbons — is believed to be responsible for Earth's increasing temperature, which could lead to severe floods and droughts, rising sea levels, and other environmental effects, affecting both life and the world's economy. After the 1997 Kyoto Protocol for the United Nations Framework Convention on Climate Change, the world has finally taken the first step in reducing emissions. The emissions are mainly a result of fossil-fuel-burning power plants. (In the United States, such electricity generation is responsible for 38 percent of the country’s carbon dioxide emissions.)
VIA aims to offer the world's first PC products certified carbon free, taking responsibility for the amounts of CO2 they emit. The company works with environmental experts to calculate the electricity used by the device over its lifetime, generally three years. From this data, one can conclude how much carbon dioxide the device will emit into the atmosphere during its operation. This estimate will serve as an indicator, and the company will pay regional organizations for the “sequestering,” or offsetting, of the emissions. Offsetting carbon dioxide can be achieved in different ways. One way is to plant trees that absorb CO2 as they grow, in the region in which the processors were purchased. The necessary amount of trees per processor is represented by VIA's TreeMark rating system.
In addition, VIA promotes the use of such alternative energy sources as solar power, so power plants wouldn't need to burn as much fossil fuels, reducing the amount of energy used. Wetlands also provide a great service in sequestering some of the carbon dioxide emitted into the atmosphere. Although they make up only 4 to 6 percent of the Earth's landmass, wetlands are capable of absorbing 20 to 25 percent of the atmospheric carbon dioxide. VIA is working closely with organizations responsible for preserving wetlands and other natural habitats, and others who support extensive recycling programs for ICT equipment. The amount paid to these organizations will be represented by a proportion of the carbon-free product’s price. Carbon-emissions control has been a key issue for many companies who have expressed a firm commitment to sustainability. Dell is a good example of a company with a green image, known for its free worldwide product-recycling program. Dell’s Plant a Tree for Me project allows customers to offset their carbon emissions by paying an extra $2 to $4, depending on the product purchased. AMD, a global microprocessor manufacturer, is also working toward reducing energy consumption in its products, cutting back on hazardous waste and reducing its eco-impact. The company’s use of silicon-on-insulator (SOI)

Wednesday, December 19, 2007

china unicom & VIA technologies CDMA chip agreement

VIA Technologies
V.K.Arora 09811153833

PRESS RELEASE

CHINA UNICOM SIGNS AGREEMENT WITH VIA TECHNOLOGIES FOR CDMA HANDSET DEVELOPMENT

New Delhi December 19. China Unicom signed a collaboration agreement with Taiwan's chip maker VIA Technologies Inc. yesterday in Beijing regarding the development of CDMA handsets, China Unicom announced today.

China Unicom the world’s largest CDMA operator said that the two companies will "leverage each other's technologies and resources", but did not reveal any more details about the partnership.

Jin Lei, public relations manager of handset manufacturer Dopod China, told Interfax that Dopod has used chips from VIA Telecom, a subsidiary of VIA Technologies, in two CDMA handsets that Dopod and China Unicom released yesterday.

"Dopod yesterday released two low-cost CDMA handsets under the new brand name 'Vivie'. Previously, Dopod provided high-end smartphones primarily to China Mobile," Jin said.

The deal between China Unicom and VIA Technologies breaks Qualcomm's monopoly in supplying CDMA chips to China Unicom and promises to lower chip costs. Qualcomm is a major CDMA chipset supplier that owns patents for CDMA-related technologies.

"We can't address specific decisions made by other companies, but we are pleased any time CDMA technology is used in mobile communication and mobile devices, as this further validates the success of CDMA," Qualcomm told Interfax.

VIA Telecom was created in April 2002 when VIA Technologies bought the CDMA wireless division of LSI Logic. In June 2003, LSI Logic's CDMA license agreement with Qualcomm was transferred to VIA Telecom.

VIA Telecom is based in San Diego, California, and is focused on developing baseband processors for the CDMA2000 standard.
China Unicom is the smaller of two mobile operators in China. It operates both CDMA and GSM mobile services. China Unicom is the world's largest CDMA operator with approximately 40.5 million CDMA subscribers.

Sunday, December 9, 2007

SERVICES INTERNATIONAL IN EXPANSION MODE

New Delhi, December 10, 2007 Riding on the ongoing boom in travel and tourism, Services International is planning big expansion of its business to capture a larger slice of the travel market.

The Delhi-based company is focusing specially on online businesses in view of the better margins and lower overheads in this segment. Services International now receives around 4,878,532 hits per month and the pages visited stands at 543,786. Number of visits stood at 254,273 and number of unique visitors was 189,126.

Services International markets its facilities through 425 working domains and it plans to increase the scope of 750 domains. The increase in online presence will provide the company more online business.

The profitability of the company is strong since online business accounts for 40% of the revenue generated by the company through inbound traffic. Services International has strong business ties with Spain and a large number of tourists from the country book their tours to India thorough the company. We are establishing ourselves in other countries where Spanish is spoken, said Mr Vinay Maheshway, director at Services. In view of the specialisation, profitability potential is strong.

Services International has been in the travel business for three decades and it is run by a team of professionals. For its expansion, the company is now in touch with serious players based overseas for a collaboration or joint venture. The company plans to scale up its revenue in a big way next financial year so that it has a larger presence in the booming Indian market for travel packages.

Contacts: Mr Vinay Maheshway 91-011-2586 2636, 9811025962.
V.K.Arora 09811153833

VIA Launches ARTiGO Builder Kit for the Pico-ITX

VIA ARTiGO A1000 Builder Kit is the first mainstream oriented DIY kit for the VIA Pico-ITX form factor, allowing enthusiasts to build their own tiny PC
New Delhi 10 December 2007 - VIA Technologies, Inc, a leading innovator of x86 silicon and platform solutions, today launched VIA ARTiGO, a DIY builder kit for enthusiasts wanting to build an ultra compact personal computer. Designed by the creators of the Pico-ITX form factor, the VIA ARTiGO Builder Kit offers consumers a more sophisticated DIY experience.

Imagine a complete x86 computer in the palm of your hand – a sleek black x86 system that can handle the day-to-day rigors of modern computing with a full complement of multimedia features. Weighing about 520g (less than 1.2lbs) and measuring a mere 15cm x 11cm x 4cm high (5.9” x 4.3” x 1.8”), the VIA ARTiGO is about half the size of a regular desktop optical drive and can even be installed inside the drive bay of a regular desktop PC.

Available from leading online and IT stores in the US and the UK, the VIA ARTiGO kit contains a VIA EPIA PX10000 Pico-ITX board, chassis, power adapter and all essential accessories, making it the ideal holiday gift for PC enthusiasts. The powerboard has been specially designed to support the remarkably low power draw, with a complete system consuming around 15 watts in idle, while the mainboard itself consumes a maximum of only 20 watts under full load.

The VIA ARTiGO package also supplies all the cabling and port accessories the DIY builder needs. Moreover, the system is customizable – simply add your choice of system memory and hard drive and you’re ready to install your choice of operating system.

“We have been overwhelmed by the positive response to the launch of the Pico-ITX boards from end-users and the embedded industry alike, so we are delighted to now make it easy for enthusiasts to build their own ultra small personal computer,” said Daniel Wu, Assistant Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA ARTiGO Builder Kit truly leverages the remarkable energy efficiency and power-performance-size ratio of the Pico-ITX form factor, and further cements VIA’s position as a leading innovator in the x86 space”.

An overview and how-to video on the VIA ARTiGO Builder Kit can be seen on the TechnoVoyance website at:
http://www.technovoyance.com/index.php?option=com_content&task=view&id=63&Itemid=1

About the VIA ARTiGO A1000 Pico-ITX Builder Kit
Inside this DIY builder’s package you’ll find one VIA EPIA PX10000 Pico-ITX board, one VIA PWB-N550 power board, an Ultra-ATA cable, PS/2 cable, COM port, DVI cables and a driver CD. Also included is the tiny black chassis with assembly accessories, a 60-watt power adapter, power cord and easy assembly instruction manual. The VIA ARTiGO chassis measures 15cm x 11cm x 4cm (5.9” x 4.3” x 1.8”).

Broadband networking is seamless through the 10/100 Fast Ethernet port, and display output through the VGA port also at the rear supports all regular monitors. Peripheral connectivity, including for the latest keyboards and mice, is made simple through four USB2.0 ports at the front of the chassis, along with two audio jacks for easy access to plug in headphones and microphone.

Powered by the 1GHz VIA C7 processor and supporting up to 1GB of DDR2 533 SO-DIMM system memory, the VIA EPIA PX mainboard is based on the single-chip VIA VX700 system media processor, boasting the VIA UniChrome Pro II IGP 3D/2D graphics core, MPEG-2/-4 and WMV9 hardware decoding acceleration and display flexibility. The onboard VIA VT1708A HD audio codec also contributes a rich entertainment experience.

Further details and specifications are available at:
http://www.via.com.tw/en/products/embedded/artigo/

VIA ARTiGO Pricing and Availability
The VIA ARTiGO Builder Kit will be available from December 14th 2007 in the US from Avnet, EPROM Computer Systems, Fry's Electronics, Logic Supply and Ma Lab / Ewiz with a recommended retail price of US$300, and from two UK online retail sites: LinITX.com and Mini-ITX.com. For further details, please contact your local VIA sales representative or send an email to: embedded@via.com.tw.

Friday, December 7, 2007

Outokumpu India plans

Outokumpu – Finnish Stainless Steel Manufacturer to focus on construction and for Pulp and Paper Applications in India
New Delhi December 7, 2007 Finland-based world's foremost stainless steel producer Outokumpu which has recently opened its sales office in India plans to focus on Architecture, Building and Construction (AB&C) and pulp and paper industry both emerging market segments in India.
Outokumpu, with a turnover of Euro five billion, (Rs 35,000 crore) specializes in manufacture of quality stainless steel for infrastructure, chemical, transport , food processing, and construction industries.based world leader in stainless steel.
Outokumpu in India has taken active participation in the ongoing paper and pulp machinery exhibition ‘Paperex’ (December 7-9, 2007) in Pragati Maidan, Delhi.
Outokumpu also supplies the pulp and paper industry on every continent with the materials, expertise and support required to build more cost-efficient plants. This focus has led to long-term partnerships (over 60 years in some cases) with many of the world’s leading suppliers to the pulp and papermaking businesses.
“Our customers expect a great deal of us. They expect us to be right on the cutting edge – all the time. They expect us to be responsible and farsighted corporate citizens, providing materials that are not only tough enough to handle punishing conditions, but also resistant enough to meet increasingly stringent environmental legislation. That’s why we have refined our duplex grades over many years. Today, we offer a broad spectrum of grades to meet varying corrosive environments” said Y.P.S Suri, India Head, Outokumpu.
" Outokumpu is all set bring stainless steel in every body's life of Indians through its full range of products and services including technical customer service to the Indian market. The company is in touch with Indian railways for use of steel in coaches, petro an food insustry as well as Delhi government for construction of Stainless steel bus stands and steel furniture , keeping in view the forthcoming Common wealth games" , Mr Suri added

“Our plants, mainly situated in Finland, Sweden, Britain and the U.S., produce a wide range of stainless steel products including hot and cold rolled coil, sheet and plate, precision strip as well as tubular and long products. Our products are available in various dimensions, grades and surface finishes: he added.
Outokumpu produces part of its raw material in its own chromium mine and ferrochrome facility. Outokumpu operates in some 30 countries and employs 11 000 people.
Yatinder Pal Singh Suri
Country Head
OUTOKUMPU India Pvt Ltd
Mobile 09818120952

Wednesday, December 5, 2007

education summit at california

VIA Demos Eco-Friendly Education at Green California Schools Summit

Innovative computing systems from HP, Devon IT, Zonbu, TabletKiosk and more lead the way in IT-savvy, environment-conscious education

New Delhi 6 December 2007 - VIA Technologies, Inc, a leading innovator and developer of power efficient PC platforms, today showcased a range of contemporary computing systems for the education market at the Green California Schools Summit, being held from December 4-6 at the Pasadena Conference Center in Pasadena, California.

With California at the leading edge of the green movement, the Green California Schools Summit will focus on the strategies, technologies and services that will ensure that schools can focus on eco-sustainability and provide a healthful learning environment for students. At booth 410, VIA will demonstrate client/server, desktop, notebook and ultra mobile partner systems that combine performance and affordability with industry-leading power economy.

Efficient computing with VIA’s pioneering processor platforms not only lowers electricity bills compared to traditional PC platforms, it significantly reduces computer-generated ambient heat, making the school environment quieter and more comfortable as well as cheaper to keep cool. It also extends the lifespan of internal components for greater system reliability, and as much as doubles battery life in mobile devices for practical education application. Of course, lower power consumption also eases demand on the current fossil fuel-burning power generation infrastructure, thereby reducing climate-warming carbon emissions.

“Power grids across the globe, and particularly in California, are under increasing strain as our need for electricity continues to grow,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “We see the Green California Schools Summit as a great opportunity to show some of the most important institutions in the country that there are real, affordable products that help manage the power problem and fully meet their next-generation education needs.”

Innovative, Efficient Computing for Schools
Perfectly suited to classroom-based teaching and with measurable benefits in manageability, security, reliability, scalability and lower electricity bills, thin clients from both Devon IT and HP will be on display at the summit. Around 50% of the thin client market is powered by VIA, with the power saving VIA Eden and VIA C7 processors specially designed for ultra compact, quiet systems with no moving parts, allowing for enhanced client performance. The VIA booth will also showcase the EPEAT Gold award-winning Zonbu PC, which delivers all the power of a traditional desktop computer but uses a fraction of the energy: an average of just 12 watts.

Additionally, see how Ultra Mobile Devices (UMDs), like the Samsung Q1b and TabletKiosk eo v7110, are being used to great effect in educational settings. VIA is a clear leader in the ultra mobile space, with over 30 partner products in the market and many more exciting designs on the way. The extreme energy efficiency of the VIA C7-M ULV processor, specially designed for ultra mobile handheld PCs, extends battery life to as much as double that of devices based on competitor platforms.

The VIA C7-D Processor and Carbon Free Computing
Traditional desktop PCs are still highly relevant in educational as well as office settings, but VIA has pioneered a green approach to this market too. With an average operating power of just 2 watts and an absolute maximum of 20 watts, VIA’s flagship desktop processor, the VIA C7-D, is designed to cater to a new breed of computer users interested in limiting their impact on the environment. Working with environmental experts, VIA calculated the electricity used by the VIA C7-D processor, and from that determined how much carbon dioxide will be produced as a result of electricity provided by power plants burning fossil fuels, and is working with regional organizations to offset that carbon dioxide.

Offsetting the carbon dioxide created through use of the C7-D processor is done through regional projects which fall into three broad categories:

· Reforestation: Planting trees that absorb (sequester) carbon dioxide as they grow, in different areas around the world
· Alternative Energy: By implementing projects utilizing alternative energy such as solar power, power plants don't need to burn as much fossil fuel, thereby reducing the amount of carbon dioxide released into the environment
· Environmental Conservation: Projects aimed at protecting our environment through donations to recognized, reputable groups that work to preserve carbon-absorbing wetlands and other necessary ecosystems

“Since the introduction of our first processor in 2001, VIA has led the industry in the design of energy-efficient x86 platforms and has enabled new generations of low power computing devices,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “By offsetting the CO2 from what is already a very power efficient component, we hope to provide a sustainable computing solution by which governments, schools, enterprise and consumers can effectively reduce their carbon footprints.”

VIA’s most recent investment is in a 30.4MW wind farm in Turkey: Anemon Enerji. The new construction consists of a grid connecting 38 wind turbines and has anticipated electricity output of 108,000 MWh per year, which is expected to reduce the equivalent of 74,700 tonnes of CO2 emissions each year. In the absence of income generated from investments such as that from VIA, operation of the wind farm and resulting environmental benefits, would be unachievable.

Anemon Enerji has been certified by The Gold Standard, a certification scheme that recognizes the best projects in the Clean Development Mechanism (CDM), Joint Implementation (JI) and voluntary offset markets. Over 49 non governmental organizations, including Greenpeace, REEEP, and WWF International, endorse the Gold Standard method.

VIA has also invested in reforestation projects in the UK, and established several solar powered ICT centers around the globe, such as in Ulutogia, Samoa and Bourem Inaly, Mali. These projects not only benefit the environment by reducing the amount of CO2 emitted into the atmosphere, but serve the local communities with access to information, going some way towards bridging the information divide that exists in developing nations.

For more on VIA’s carbon free projects, please see the Green Computing Initiative pages on the VIA website: http://www.via.com.tw/en/initiatives/greencomputing/.

Additionally, a video explaining the concept behind the carbon free VIA C7-D desktop processor can be found at The Green Lounge, a VIA website dedicated to green computing that looks at all the latest news in this fast-growing area, along with images of the Anemon Enerji Wind Farm in the Gallery section.
http://www.thegreenlounge.org/index.php?option=com_content&task=view&id=49&Itemid=1


About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw

VIA PR Contact

International:
Richard Brown
Phone:
(886)-2-2218-5452 #6201
Fax:
(886)-2-2218-5453
Email:
RIBrown@via.com.tw

Note to reporters, editors and writers: VIA is written in ALL CAPS.

The names of actual companies and products mentioned herein may be the trademarks of their respective owners.

Sunday, December 2, 2007

green motherboards from VIA

VIA'S LAUNCHES ITS ENERGY-EFFICIENCY GREEN MOTHERBOARDS

New Delhi- December 2, 2007 Chipset and motherboard designer VIA Technologies has announced its latest PC2500 and PC3500 motherboards. These are very energy-efficient and VIA makes the world's smallest and most energy-efficient X86 platforms for personal computers .

VIA makes X86 processing chips, which are focussed on energy-efficiency rather than chasing higher clock rates and/or all-out performance. Because of this it has also focussed on small size and, as well as making desktop PC mainboards, it has ones for laptops, Nano-ITX board for mini-laptops, Pico-ITX for hand-held PDA/PC form-factor devices and a new Mobile-ITX board for mobile phones combining hand-held PC and phone functionality.

VIA's green credentials come from this and also from it purchasing carbon offsets to try and remove carbon from the atmosphere equivalent to that released from power plants providing the electricity its products need. VIA only deals in offsets certified by The Gold Standard, a scheme endorsed by Greenpeace, the World Wildlife Fund and over 45 other non-governmental organisations. VIA says its CD-7 is the first carbon-free processor because of this. Its low power draw products means that solar power is become practicable as an energy supply source for them.

The pc3500 mainboard offers the lowest power consumption for Windows Vista PCs; a complete VIA pc3500-based PC draws 50 percent less than the Energy Star 4.0 requirements specify. According to VIA's corporate marketing VP, Richard Brown, Intel's Low Power CPU for Vista draws around 60 watts. A complete PC using this would draw around 100 watts. A PC built around VIA's pc3500 would draw about 60 watts, 40 percent less.

The Energy Star 4.0 requirement is for a PC in idle mode to draw less than 50 watts. Such a VIA-based PC would draw about 23 watts. Even when very busy with, for example, DVD playback, it would only draw around 34 watts. Running a Vista performance test it would draw about 50 watts. In comparison a Pentium 4-type mid-range PC would draw around 250 watts; five times more.

Brown thinks that thin client use will expand: "Globally every one will have to digitise. The standard PC model is not well-suited for this, having size, power-draw and waste issues." Several OEMs, such as HP, use VIA products in their thin client products.

The new Pc-1 motherboards have already been launched and are available in the UK market.They have already got wide industry support

website: http://www.via.com.tw/en/products/processors/c7-d/partner_products.jsp

Monday, November 26, 2007

Taiwan UMPC

VIA Technologies
Taiwan Develops powerful UMPC using VIA Processor for WiMax
New Delhi November 27, 2007 Taiwan has developed a powerful ultramobile PC that can fit in your hand, complete with a speedy 1GHz microprocessor on board.
New Delhi November 26, 2007 Taiwan has developed a powerful ultramobile PC that can fit in your hand, complete with a speedy 1GHz microprocessor made by VIA Technologies on board.
The aim of the device is to take advantage of all the Internet has to offer via a WiMax wireless broadband network currently in the works on the island and in several other countries around the world, including the U.S.
That's why a few government-funded research groups in Taiwan teamed up to develop a small handheld device with the power of a laptop PC able to handle Internet video, networking and downloading available on WiMax networks.
The MTube, as the device is called, carries a 1GHz microprocessor made by Via Technologies Inc., an x86-based processor able to use software meant for PCs. But the MTube weighs only 150 grams and has a 2.8-inch screen, so it's small enough to fit in person's pocket. It can store 8G bytes of songs, photos and other data and runs on a Linux OS.
Development of the MTube, which is made solely from parts manufactured in Taiwan, is aimed at promoting Taiwanese made goods, as well as developing more devices and applications for WiMax wireless Internet broadband services.
Taiwan is positioning itself to be one of the fastest adopters of WiMax connectivity outside of North America through its M Taiwan initiative. Officials see the technology as a good way to spread broadband Internet access throughout the island, which includes remote mountain villages and sparsely populated outlying islands.
Last month, the Taiwan government added several multinationals to a growing list of WiMax wireless broadband technology partners, including Alcatel-Lucent, Motorola, Nokia Siemens Networks and Sprint Nextel. The partnerships are intended to encourage foreign companies to build WiMax research and development centers in Taiwan and look to Taiwanese companies for parts and contract manufacturing work.
Intel was an early champion of WiMax as a replacement for the Wi-Fi wireless networking standard, used for Internet access in coffee shops, airports and other places in much of the developed world. The chip giant has already signed a similar agreement with Taiwan and is working with Taiwanese computer parts makers to ready the technology for inclusion in laptop PCs next year.

Sunday, November 25, 2007

green computing

VIA Technologies Green Computing
VIA Technologies, a Taiwanese company that manufactures motherboard chipsets, CPUs, and other computer hardware, introduced its initiative for "green computing" in 2001. With this green vision, the company has been focusing on power efficiency throughout the design and manufacturing process of its products. Its environmentally friendly products are manufactured using a range of clean-computing strategies, and the company is striving to educate markets on the benefits of green computing for the sake of the environment, as well as productivity and overall user experience.
Carbon-free computing

Carbon-free computing (Credit: VIA)One of the VIA Technologies’ ideas is to reduce the "carbon footprint" of users — the amount of greenhouse gases produced, measured in units of carbon dioxide (CO2). Greenhouse gases naturally blanket the Earth and are responsible for its more or less stable temperature. An increase in the concentration of the main greenhouse gases — carbon dioxide, methane, nitrous oxide, and fluorocarbons — is believed to be responsible for Earth's increasing temperature, which could lead to severe floods and droughts, rising sea levels, and other environmental effects, affecting both life and the world's economy. After the 1997 Kyoto Protocol for the United Nations Framework Convention on Climate Change, the world has finally taken the first step in reducing emissions. The emissions are mainly a result of fossil-fuel-burning power plants. (In the United States, such electricity generation is responsible for 38 percent of the country’s carbon dioxide emissions.)VIA aims to offer the world's first PC products certified carbon free, taking responsibility for the amounts of CO2 they emit. The company works with environmental experts to calculate the electricity used by the device over its lifetime, generally three years. From this data, one can conclude how much carbon dioxide the device will emit into the atmosphere during its operation. This estimate will serve as an indicator, and the company will pay regional organizations for the “sequestering,” or offsetting, of the emissions. Offsetting carbon dioxide can be achieved in different ways. One way is to plant trees that absorb CO2 as they grow, in the region in which the processors were purchased. The necessary amount of trees per processor is represented by VIA's TreeMark rating system.
In addition, VIA promotes the use of such alternative energy sources as solar power, so power plants wouldn't need to burn as much fossil fuels, reducing the amount of energy used. Wetlands also provide a great service in sequestering some of the carbon dioxide emitted into the atmosphere. Although they make up only 4 to 6 percent of the Earth's landmass, wetlands are capable of absorbing 20 to 25 percent of the atmospheric carbon dioxide. VIA is working closely with organizations responsible for preserving wetlands and other natural habitats, and others who support extensive recycling programs for ICT equipment. The amount paid to these organizations will be represented by a proportion of the carbon-free product’s price.
Carbon-emissions control has been a key issue for many companies who have expressed a firm commitment to sustainability. Dell is a good example of a company with a green image, known for its free worldwide product-recycling program. Dell’s Plant a Tree for Me project allows customers to offset their carbon emissions by paying an extra $2 to $4, depending on the product purchased. AMD, a global microprocessor manufacturer, is also working toward reducing energy consumption in its products, cutting back on hazardous waste and reducing its eco-impact. The company’s use of silicon-on-insulator (SOI) technology in its manufacturing, and strained silicon capping films on transistors (known as “dual stress liner” technology), have contributed to reduced power consumption in its products.
Solar Computing

Solar powered computingAmid the international race toward alternative-energy sources, VIA is setting its eyes on the sun, and the company's Solar Computing initiative is a significant part of its green-computing projects. For that purpose, VIA partnered with Motech Industries, one of the largest producers of solar cells worldwide. Solar cells fit VIA's power-efficient silicon, platform, and system technologies and enable the company to develop fully solar-powered devices that are nonpolluting, silent, and highly reliable. Solar cells require very little maintenance throughout their lifetime, and once initial installation costs are covered, they provide energy at virtually no cost. Worldwide production of solar cells has increased rapidly over the last few years; and as more governments begin to recognize the benefits of solar power, and the development of photovoltaic technologies goes on, costs are expected to continue to decline. As part of VIA's “pc-1” initiative, the company established the first-ever solar-powered cyber community center in the South Pacific, powered entirely by solar technology

Sunday, November 4, 2007

VIA Announces Ultra Thin VESA Mounted PC for Instant Display Systems

The VIA vmpc vm7700, a unique approach to digital signage and media display, converts any standard LCD monitor into a full x86 PC in minutes

Taipei, Taiwan, 8 October 2007 - VIA Technologies, Inc, a leading developer of x86 silicon and platform solutions, today announced the new VIA vm7700 VESA mounted PC (vmpc) that turns a standard display panel into a fully functional PC for signage, kiosk and other intelligent display applications, providing a radically superior space management, cost effective and flexible alternative to traditional panel PCs.

From small desktop LCD monitors to larger flat panel displays, the VIA vmpc vm7700 leverages the industry-standard Video Electronics Standards Association (VESA) 10cm x 10cm mounting specification for simple attachment behind the customer’s screen of choice, and offers considerable cost savings when upgrading or replacing screens. Through-chassis mounting allows the VIA vm7700 to be secured behind a flat screen display in seconds, or firmly mounted on walls or under desks, while dual-view support extends display utility.

Fanless configurations based on a 1.0GHz VIA C7 or 1.5GHz VIA Eden ULV processor and the ultra low power VIA CX700M2 system media processor enable the VIA vm7700 to deliver a solution packed with rich multimedia features within a maximum power of only 12 watts and a low 45ÂșC thermal envelope – essential for display-mounted systems.

Housed within a durable, ultra-thin and sleek black 26mm x 180mm x 298mm chassis, the VIA vm700 provides the answer for a wide spectrum of intelligent display applications, such as state-of-the-art casino gaming, home automation, information kiosks, timetable boards, advertising and more, as well as a discreet system for space-constrained locations.

“The VIA vm7700 VESA-mounted PC is a revolutionary concept that delivers an efficient, cost-effective method of delivering x86 technology simply and discreetly,” said Daniel Wu, Assistant Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “With its robust multimedia performance and inherent display flexibility, the vm7700 offers a strong alternative to panel PCs.”

A short video on the VIA vmpc vm7700 may be seen at the Technovoyance website at:
http://www.technovoyance.com/........., while more details on the system may be found on the VIA website at: http://www.via.com.tw/en/products/embedded/vm7700/.

About the VIA vm7700 VESA-mounted PC
Available with either the 1.0GHz VIA C7 or 1.5GHz VIA Eden ULV processors, the VIA vmpc vm7700 supports up to 1GB of power efficient DDR2 system memory, a 2.5” HDD or DOM interface, four USB ports and a COM port as standard. Networking is taken care of with a VIA Gigabit Ethernet port and optional Wireless IEEE 802.11b/g module. The completely fanless vm7700 mounted PC also has DVI-D, D-Sub and S-Video TV-out interfaces with native dual-view configurations. System management options include Wake-on-Lan, ACPI support, Power Failure Recovery and Watch Dog Timer features.

Featuring the VIA CX700M2 system media processor - an all-in-one digital media IGP chipset that integrates premium graphics, audio, storage, memory and HDTV support in a single power-efficient chip - the VIA vm7700 has visual prowess and versatility in abundance. Featuring the VIA UniChrome Pro II IGP graphics core with MPEG-2/-4 and WMV9 hardware acceleration, dual-view across both DVI and VGA sockets, the VIA vm7700 is a robust video platform that won’t compromise system stability.

The VIA vm7700 is designed to fit displays with the 100mm x 100mm VESA mounting specification; however, adaptors are widely available for more compact screens with the other VESA mounting specification sizes.

The VIA vm7700 is compatible with all leading embedded and desktop operating systems, including Microsoft Windows XP, XPe and CE, and Linux.

VIA vmpc vm7700 Pricing and Availability
The VIA vmpc vm7700 is available now for project customers; for pricing and more details, please contact your local VIA sales representative or send an email to:
embedded@via.com.tw


About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw

VIA PR Contact

International:
VK Arora
Phone:
+91-981-115-3833
Fax:

Email:
varinderkarora@gmail.com

Note to reporters, editors and writers: VIA is written in ALL CAPS.

The names of actual companies and products mentioned herein may be the trademarks of their respective owners.

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